Packaging test method

Packaging test method

  • CN 103,730,376 A
  • Filed: 10/15/2012
  • Published: 04/16/2014
  • Est. Priority Date: 10/15/2012
  • Status: Active Application
First Claim
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1. a packaging and testing method, is suitable for semiconductor encapsulation unit to test, and comprising:

  • This semiconductor packages unit is provided, this semiconductor packages unit comprises a packing colloid, a lead frame and a plurality of Cutting Road, described a plurality of Cutting Road defines a plurality of semiconductor encapsulated elements on semiconductor packages unit, each semiconductor encapsulated element has a plurality of external connection terminals, is positioned on this lead frame;

    Along described a plurality of Cutting Roads, cut off this lead frame, so that described a plurality of semiconductor encapsulated element is electrically insulated each other;

    This semiconductor packages unit is loaded on a carrying wafer;

    With this carrying wafer, this semiconductor packages unit is sent to a tester table, this tester table has a probe;

    Make probe near loading this semiconductor packages unit on this carrying wafer, a plurality of probe terminals that this probe possesses are contacted with this external connection terminals respectively, so that this semiconductor encapsulated element is respectively tested;

    Labeled test result is abnormal described a plurality of semiconductor encapsulated elements;

    A plurality of semiconductor encapsulated elements described in singulation;

    AndRemove and be marked as abnormal described a plurality of semiconductor encapsulated elements.

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