Elimination of silicon residues from MEMS cavity floor

Elimination of silicon residues from MEMS cavity floor

  • CN 103,732,528 A
  • Filed: 08/03/2012
  • Published: 04/16/2014
  • Est. Priority Date: 08/03/2011
  • Status: Active Application
First Claim
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1. a method of manufacturing MEMS device, comprising:

  • Thering is the Part I that is enclosed in cavity and be arranged on deposition of adhesion on the substrate of Part II of described cavity outside;

    Remove the described adhesion layer in the region being arranged on described Part I;

    Deposition of sacrificial layer on the Part I of described adhesion layer and described substrate;

    On described sacrifice layer, form switch element;

    Described switch element is enclosed in described cavity;

    AndRemove described sacrifice layer.

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