Silicon residue is eliminated from MEMS cavity bottoms

Silicon residue is eliminated from MEMS cavity bottoms

  • CN 103,732,528 B
  • Filed: 08/03/2012
  • Issued: 09/28/2018
  • Est. Priority Date: 08/03/2011
  • Status: Active Grant
First Claim
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1. a kind of method of manufacture MEMS device, including:

  • With in cavity to be enclosed in first part and sink to be arranged on the substrate of the second part outside the cavityProduct adhesion layer;

    Remove the adhesion layer being arranged in the region in the first part;

    The deposited sacrificial layer in the first part of the adhesion layer and the substrate;

    Switch element is formed on the sacrificial layer;

    The switch element is enclosed in the cavity;

    AndRemove the sacrificial layer.

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