3D (three-dimensional) metal-based copper-clad plate

3D (three-dimensional) metal-based copper-clad plate

  • CN 103,770,400 A
  • Filed: 01/09/2014
  • Published: 05/07/2014
  • Est. Priority Date: 01/09/2014
  • Status: Active Application
First Claim
Patent Images

1. 3D stereo metal base copper-clad plate, comprise metal substrate (1), and be arranged on metal substrate (1) conductive metal foil (2) above, it is characterized in that:

  • between described metal substrate (1) and conductive metal foil (2), be provided with insulating barrier (3), described insulating barrier (3) comprises the acrylic resin or the epoxy resin that utilize acrylonitrile-butadiene rubber, polyvinyl butyral fat, polyimides to carry out modification.

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