Fan-out wafer level package structure

Fan-out wafer level package structure

  • CN 103,779,235 A
  • Filed: 01/17/2013
  • Published: 05/07/2014
  • Est. Priority Date: 10/19/2012
  • Status: Active Application
First Claim
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1. a method that is used to form encapsulating structure, comprising:

  • Above carrier, apply tube core, described tube core has multiple installed parts;

    One or more through holes are provided on described carrier;

    Above described carrier He around described through hole, forming molded substrate;

    Reduce the first side that described molded substrate is relative with described carrier and expose described one or more through hole at described molded substrate the first side place relative with described carrier;

    In the first side of described molded substrate, form redistributing layer (RDL), described RDL has multiple RDL contact pads;

    AndExpose described one or more through hole at the second side place that described molded substrate is relative with the first side.

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