Encapsulation structure, encapsulation method and template used in encapsulation method

Encapsulation structure, encapsulation method and template used in encapsulation method

  • CN 103,779,286 A
  • Filed: 01/26/2014
  • Published: 05/07/2014
  • Est. Priority Date: 01/26/2014
  • Status: Active Application
First Claim
Patent Images

1. an encapsulating structure, wherein, this encapsulating structure comprises:

  • Substrate;

    Chip, is mounted on described substrate;

    Lead-in wire, for being electrically connected described substrate with described chip;

    AndProtective layer, is formed on described substrate, and for the pad that covers described chip, described lead-in wire and be connected with described lead-in wire, the size of described protective layer is less than the size of described substrate.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×