Fracturing method and marking device of laminated ceramic substrate

Fracturing method and marking device of laminated ceramic substrate

  • CN 103,786,262 A
  • Filed: 08/02/2013
  • Published: 05/14/2014
  • Est. Priority Date: 10/30/2012
  • Status: Active Application
First Claim
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1. a method for dividing for laminated ceramic substrate, has the method for dividing of the laminated ceramic substrate of metal film at the two sides of ceramic substrate lamination, it is characterized in that:

  • Utilize patterned tool, along the delineation preset lines of this laminated ceramic substrate, the metal film of one is carried out to groove processing;

    Utilize patterned tool, along the delineation preset lines of this laminated ceramic substrate, the metal film of another one is carried out to groove processing;

    Make scribe wheel rotate and this ceramic substrate is delineated along the groove that any one metal film is removed after metal film from this;

    Delineation line according to this laminated ceramic substrate ruptures.

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