Conductive sealant compositions

Conductive sealant compositions

  • CN 103,797,542 A
  • Filed: 09/11/2012
  • Published: 05/14/2014
  • Est. Priority Date: 09/16/2011
  • Status: Active Application
First Claim
Patent Images

1. encapsulant composition, comprises:

  • The base composition that comprises sulfur-containing polymer;

    The curing agent composition that comprises curing agent;

    WithConductive filler at described base composition or curing agent composition in one of at least, this conductive filler comprises carbon nano-tube and stainless steel fibre.

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