Method for bonding two substrates

Method for bonding two substrates

  • CN 103,820,041 A
  • Filed: 11/15/2013
  • Published: 05/28/2014
  • Est. Priority Date: 11/16/2012
  • Status: Active Application
First Claim
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1. the method for two bases (1,2) are combined, the method comprises the following steps:

  • -be applied to the first base (1) above in connection with agent (4),-make described bonding agent (4) partially hardened,-the second base (2) is applied to bonding agent (4) above,-wherein, before described bonding agent (4) hardens completely, the second base (2) is applied on described bonding agent (4).

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