Technique for preparing absorptive substrate and the integrated processing system for substrate

Technique for preparing absorptive substrate and the integrated processing system for substrate

  • CN 103,827,378 B
  • Filed: 07/30/2012
  • Issued: 11/09/2018
  • Est. Priority Date: 08/01/2011
  • Status: Active Grant
First Claim
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1. a kind of technique for handling sorptive material, including:

  • It is that substrate enters in cleaning systems by the volume debatching of sorptive material;

    Substrate movement is passed through into the acoustic energy section in the cleaning systems, wherein in the front of the substrate and the back sideEach be exposed to the energy pulse from cleaning one or more of liquid bath sound energy generator, and it is one or moreAt least one of a sound energy generator is with the tubular resonators of the frequency work between 20kHZ and 50kHZ;

    AndAfter the sorptive material passes through the acoustic energy section, it is by the cleaning by substrate movement furtherDrying section in system, wherein by it is heated and through HEPA filtered airs be applied to be clean the sorptive material;

    After moving the substrate by the drying section, the substrate is cut into chunks to form multiple individual cleaning pieces;

    The cleaning piece is put into bag;

    AndSeal the bag;

    Wherein the substrate is cut into chunks and is not contacted the step that the cleaning piece is put into bag in the hand of people substantially describedIt is carried out in the case of sorptive material;

    Wherein, the cleaned sorptive material with drying equably there are every square metre of less than 150 length to be more than 100 micro-The pollution fibres of rice;

    The acoustic energy section includes:

    First group of roller is used to guide the substrate to surround the first tubular resonators, and the front of the substrate is straightIt connects and is exposed to the ultrasonic energy from first tubular resonators;

    AndSecond group of roller is used to guide the substrate to surround the second tubular resonators, and the back side of the substrate is straightIt connects and is exposed to the ultrasonic energy from second tubular resonators.

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