METHOD OF DIVIDING SUBSTRATE WITE PATTERN

METHOD OF DIVIDING SUBSTRATE WITE PATTERN

  • CN 103,846,560 A
  • Filed: 09/16/2013
  • Published: 06/11/2014
  • Est. Priority Date: 11/29/2012
  • Status: Active Application
First Claim
Patent Images

1. a dividing method for the figuratum substrate of tool, is that the figuratum substrate of tool forming repeatedly configure two-dimensionally multiple unit element patterns on single crystallization base plate is cut apart and singualtion, it is characterized in that:

  • The figuratum substrate of this tool, is by the interarea that is opposition side with the forming surface of this unit element pattern in this single crystallization base plate multilayer film that alternatively 2 different oxide-films of lamination form repeatedly, forms with metal film lamination;

    Possess;

    Metal film is removed step, to be positioned under the state of interfacial level of this multilayer film and this metal film at this front end that makes front end possess the instrument of cutter front end, this instrument is relatively moved the figuratum substrate of this tool, only remove this metal film and form processing groove along the processing preset lines predetermining at the figuratum substrate of this tool whereby;

    Procedure of processing is stretched in be full of cracks, to removing the figuratum substrate of this tool after this metal film, along this processing preset lines, the mode that is positioned at discretely this processing groove with the processing trace forming at the figuratum substrate of this tool by each unit pulse light is irradiated laser, makes to chap to stretch from each this processing trace in the figuratum substrate of this tool;

    AndBrisement step, is the figuratum substrate of this tool to stretch procedure of processing through this be full of cracks, carries out brisement along this processing preset lines.

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