Housing, manufacturing method thereof, and electronic device using the same

Housing, manufacturing method thereof, and electronic device using the same

  • CN 103,847,063 A
  • Filed: 10/25/2013
  • Published: 06/11/2014
  • Est. Priority Date: 11/28/2012
  • Status: Active Application
First Claim
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1. manufacture a method for the housing of electronic equipment, described method comprises:

  • Manufacture housing body by stacked composite material sheet and plastic sheet successively, wherein, to plastic sheet described at least one surface applications in upper surface and the lower surface of described composite material sheet;

    AndBy insert-molding moulding plastics injection molding product on the described plastic sheet of described housing body, with the connectivity fastening described composite material sheet in ground and described housing body and described plastic sheet.

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