Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil

Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil

  • CN 103,857,833 A
  • Filed: 09/18/2012
  • Published: 06/11/2014
  • Est. Priority Date: 09/30/2011
  • Status: Active Application
First Claim
Patent Images

1. an electrolytic copper foil, described electrolytic copper foil is the upper electrolytic copper foil that forms alligatoring particle of the alligatoring face (M face) at electrolytic copper foil, it is characterized in that, the mean size of described alligatoring particle is 0.1~

  • 1.0 μ

    m.

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