Resin composition, and resin sheet, prepreg, laminate, metal substrate and printed circuit board using same

Resin composition, and resin sheet, prepreg, laminate, metal substrate and printed circuit board using same

  • CN 103,917,605 A
  • Filed: 11/02/2011
  • Published: 07/09/2014
  • Est. Priority Date: 11/02/2011
  • Status: Active Application
First Claim
Patent Images

1. a resin combination, it comprises:

  • the first filler, it is 1nm~

    500nm that described the first filler is accumulated 50% corresponding median size D50 from the small particle size side of weight build-up size-grade distribution, and comprises Alpha-alumina;

    The second filler, it is 1 μ

    m~

    100 μ

    m that described the second filler is accumulated 50% corresponding median size D50 from the small particle size side of weight build-up size-grade distribution;

    And in molecule, there is the thermosetting resin of mesomorphic group.

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