Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition

Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition

  • CN 103,937,156 A
  • Filed: 03/05/2014
  • Published: 07/23/2014
  • Est. Priority Date: 03/05/2014
  • Status: Active Application
First Claim
Patent Images

1. a resin combination, it is characterized in that:

  • this resin combination is scattered in organic solvent and is made by each component of following parts by weight;

    10~

    80 parts of epoxy resin, 10~

    60 parts of cyanates, bismaleimides 10-60,10~

    50 parts of polyphenylene oxide, 0.01~

    1.0 part of curing catalyst, 1~

    40 part of fire retardant, 0~

    100 part of mineral filler, the solid content of described resin combination is 30wt%~

    70wt%.

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