Image sensor mould group and forming method thereof

Image sensor mould group and forming method thereof

  • CN 103,943,645 B
  • Filed: 05/20/2014
  • Issued: 04/23/2019
  • Est. Priority Date: 05/20/2014
  • Status: Active Grant
First Claim
Patent Images

1. a kind of image sensor mould group characterized by comprisingSubstrate, the substrate have front and the back side opposite with the front;

  • Buffer layer positioned at the substrate front surface and the metal layer positioned at buffer-layer surface;

    The crystal grain being inverted in above substrate, the crystal grain have video sensing area and the pad around the video sensing area, andThe pad and metal layer electrical connection;

    Positioned at the solder-bump of the layer on surface of metal;

    It is covered in the plastic packaging layer of metal layer and grain surface;

    Through-hole in plastic packaging layer, the via bottoms exposeLayer on surface of metal, and solder-bump fills the full through-hole, is higher than plastic packaging layer surface at the top of solder-bump;

    Lens assembly, the lens assembly include microscope base and eyeglass, wherein the eyeglass passes through microscope base and the backside of substrate phaseConnection.

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