Solder is integrated on controlled tube core and its assembly method in encapsulation

Solder is integrated on controlled tube core and its assembly method in encapsulation

  • CN 103,946,965 B
  • Filed: 11/14/2011
  • Issued: 04/02/2019
  • Est. Priority Date: 11/14/2011
  • Status: Active Grant
First Claim
Patent Images

1. a kind of technique for making die backside protrusion, comprising:

  • In die back side form DBF recessing with appear the through silicon via TSV in tube core contact, the tube core include active surface andBack surface;

    The groove is filled with the conductive material for contacting the TSV contact;

    AndBeing welded with to the conductive material is formed in the level of the DBF,Wherein the DBF has first thickness, the technique further include;

    Remove the DBF;

    AndThe underfill of underfill is carried out to contact the conductive material and described at least one of be welded with.

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