Image sensor module and forming method thereof

Image sensor module and forming method thereof

  • CN 103,956,371 A
  • Filed: 05/20/2014
  • Published: 07/30/2014
  • Est. Priority Date: 05/20/2014
  • Status: Active Application
First Claim
Patent Images

1. an image sensor module, is characterized in that, comprising:

  • PCB substrate, has the hole that runs through described PCB substrate in described PCB substrate;

    Be positioned at the metal level of described PCB substrate surface;

    The image sensor chip of upside-down mounting above PCB substrate, described image sensor chip has video sensing district and around the pad in described video sensing district, wherein, described video sensing district is positioned at hole top, and described pad and metal level are electrically connected to;

    The signal processing chip of upside-down mounting above PCB substrate, described signal processing chip is electrically connected to metal level;

    Be positioned at the solder-bump of described layer on surface of metal.

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