Die bonding method

Die bonding method

  • CN 103,964,375 B
  • Filed: 02/01/2013
  • Issued: 10/16/2018
  • Est. Priority Date: 02/01/2013
  • Status: Active Grant
First Claim
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1. a kind of die bonding method, which is characterized in that including:

  • Chip to be bonded is set to and is heated the substrate, the chip to be bonded is fixed using central positioner;

    The chip to be bonded is heated to the first temperature;

    Multiple gas filling and vacuum are recycled, prevents from being bonded shift phenomenon;

    Continue to heat the chip to be bonded to second temperature, carries out chip bonding.

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