Method and apparatus for wafer seal ring

Method and apparatus for wafer seal ring

  • CN 103,972,144 A
  • Filed: 09/03/2013
  • Published: 08/06/2014
  • Est. Priority Date: 02/05/2013
  • Status: Active Application
First Claim
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1. a method, comprising:

  • In the die area of the first wafer, on described the first wafer, form a plurality of the first tube cores;

    On described the first wafer, form a plurality of the first tube core adapter rings, described a plurality of the first tube core adapter rings have the first width and the first interval;

    AndIn the sealing ring region of described the first wafer, on described the first wafer, form the first wafer sealing ring, described the first wafer sealing ring comprises the many lines with the second width and the second interval, and the first width of wherein said a plurality of the first tube core adapter rings and the cross section at the first interval approximate the second width of described the first wafer sealing ring and the cross section at the second interval.

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