Method for forming glass package and method for forming OLED device

Method for forming glass package and method for forming OLED device

  • CN 104,003,618 A
  • Filed: 10/16/2009
  • Published: 08/27/2014
  • Est. Priority Date: 10/20/2008
  • Status: Active Application
First Claim
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1. a method that forms glass-encapsulated, it comprises:

  • Frit is deposited on the first glass substrate;

    This first glass substrate is connected on the second glass substrate;

    With frit described in radiation source irradiates, to be formed on the gas-tight seal between the first glass substrate and the second glass substrate;

    Wherein, described frit comprises the not glass containing antimony, and described glass comprises;

    V 2o 5(40-50 % by mole) P 2o 5(>

    =20 % by mole and <

    25 % by mole) ZnO (0-10 % by mole)Fe 2o 3(>

    0 % by mole and <

    25 % by mole) TiO 2(>

    0 % by mole and <

    25 % by mole);

    With Wherein, TiO 2+ Fe 2o 3in the scope of 20 % by mole to 35 % by mole.

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