Resin composition for sealing

Resin composition for sealing

  • CN 104,039,888 A
  • Filed: 01/15/2013
  • Published: 09/10/2014
  • Est. Priority Date: 01/16/2012
  • Status: Active Application
First Claim
Patent Images

1. resin composition for encapsulating, is characterized in that, contains (A) vinylbenzene-iso-butylene modified resin and (B) tackifying resin.

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