Semiconductor device, optical semiconductor device, and heat-dissipating member

Semiconductor device, optical semiconductor device, and heat-dissipating member

  • CN 104,040,712 A
  • Filed: 12/04/2012
  • Published: 09/10/2014
  • Est. Priority Date: 12/22/2011
  • Status: Active Application
First Claim
Patent Images

1. a semiconductor device, is characterized in that, possesses:

  • For install semiconductor element installation base plate,With the cooling component of described installation base plate devices spaced apart ground arranged opposite andBetween described installation base plate and described cooling component and with described installation base plate and the closely sealed radiating component of described cooling component,The tensile modulus of elasticity that described radiating component is measured under chuck spacing 20mm, draw speed 300mm/min, the condition of 23 ℃

    is below 600MPa.

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