COPPER FOIL WITH ADHESIVE LAYER, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD

COPPER FOIL WITH ADHESIVE LAYER, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD

  • CN 104,041,198 A
  • Filed: 01/11/2013
  • Published: 09/10/2014
  • Est. Priority Date: 01/11/2012
  • Status: Active Application
First Claim
Patent Images

1. with a Copper Foil for adhesive phase, it is the Copper Foil with adhesive phase in the one side of Copper Foil with adhesive phase, it is characterized in that,Described adhesive phase is to be the layer that 5 mass parts are above, the resin combination of styrene butadiene block copolymer below 65 mass parts forms by containing with respect to the polyphenylene ether compound of 100 mass parts.

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