SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

  • CN 104,051,354 A
  • Filed: 04/02/2013
  • Published: 09/17/2014
  • Est. Priority Date: 03/12/2013
  • Status: Active Application
First Claim
Patent Images

1. a semiconductor package part, it comprises:

  • One intermediate plate, it has the first relative side and the second side, and the first conduction perforation of this first side of a plurality of connection and this second side;

    At least one the first semiconductor subassembly, it is incorporated in the first side of this intermediate plate and is electrically connected this intermediate plate;

    The first packing colloid, it is formed in the first side of this intermediate plate to be coated this first semiconductor subassembly, and makes this first semiconductor subassembly expose to this first packing colloid;

    At least one the second semiconductor subassembly, it is arranged on this first semiconductor subassembly and is electrically connected at this first semiconductor subassembly;

    AndThe second packing colloid, it is formed on this first semiconductor subassembly and the first packing colloid, to be coated this second semiconductor subassembly.

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