Coreless substrate with passive device pads

Coreless substrate with passive device pads

  • CN 104,051,361 A
  • Filed: 03/13/2014
  • Published: 09/17/2014
  • Est. Priority Date: 03/13/2013
  • Status: Active Application
First Claim
Patent Images

1. an encapsulation assembling, comprising:

  • Without core substrate, comprise the first side, second side relative with the first side and the multiple accumulation horizons between the first side and the second side;

    Two or more passive device pads, are arranged in described the first side without core substrate;

    Electric fixed line feature, is arranged in described the second side without core substrate;

    AndElectrical path, be defined in described multiple accumulation horizon with between described two or more passive device pads and described electric fixed line feature to electric power fixed line,Wherein said electrical path comprises the transport element being arranged on described accumulation horizon or in accumulation horizon, and described transport element is coupled in described two or more passive device pad conduction.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×