Heat-radiating structure, semiconductor packaging part and manufacturing method thereof

Heat-radiating structure, semiconductor packaging part and manufacturing method thereof

  • CN 104,051,373 A
  • Filed: 03/20/2013
  • Published: 09/17/2014
  • Est. Priority Date: 03/14/2013
  • Status: Active Grant
First Claim
Patent Images

1. a radiator structure, it comprises:

  • Fin, it is formed in one, and has periphery, relative the first side and the second side, and this periphery, the first side and the second side are formed with respectively rank portion, the first protuberance and recess;

    AndIn conjunction with reinforced layer, it is formed at least part of surface of the first side of this fin.

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