The manufacturing method of power module substrate

The manufacturing method of power module substrate

  • CN 104,067,386 B
  • Filed: 02/01/2013
  • Issued: 05/28/2019
  • Est. Priority Date: 02/01/2012
  • Status: Active Grant
First Claim
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1. a kind of manufacturing method of power module substrate, which is characterized in that in the power module substrate, by copper or copperThe copper sheet that alloy is constituted is laminated and is engaged in the surface of ceramic substrate, and aluminium sheet is laminated and is engaged in the back side of ceramic substrate,The ceramic substrate is the AlN or Si with a thickness of 0.2~1.5mm3N4,The copper sheet with a thickness of 0.1mm or more and 1.0mm hereinafter,The aluminium sheet with a thickness of 0.6mm or more and 6.0mm hereinafter,The manufacturing method includesCopper part engagement slurry painting process, in the joint surface of the ceramic substrate and the joint surface of the copper sheet at leastOne joint surface is coated with copper part engagement slurry and drying, to form Ag and nitrogen containing Ag and nitride forming elementCompound formation element layer;

  • The ceramic substrate and the copper sheet is laminated via the Ag and nitride forming element layer in 1st lamination process;

    1st heating process, to the ceramic substrate and the copper sheet of stacking, to stacking direction with 1~35kgf/cm2Pressurization is simultaneouslyIt is heated, forms molten metal region at the interface of the ceramic substrate and the copper sheet;

    1st solidification process, engages the ceramic substrate and the copper sheet and making the molten metal zone freezing;

    2nd lamination process, at the back side for the ceramic substrate for engaging the copper sheet, via 5~50 μ

    m of thickness of Al-Si systemThe aluminium sheet is laminated in solder foil;

    2nd heating process, to the ceramic substrate and the aluminium sheet of stacking, to stacking direction with 1~35kgf/cm2Pressurization is simultaneouslyIt is heated, forms molten metal region at the interface of the aluminium sheet and the ceramic substrate;

    And2nd solidification process, is solidified and keeping the molten metal region cooling, to engage the ceramic substrate and the aluminiumPlate,The copper part engagement slurry contains 40 mass % or more and 90 mass % powdered ingredients below,The content of nitride forming element described in the powdered ingredients is 0.4 mass % or more and 75 mass % are hereinafter, contain 0Quality % or more and 50 mass % addition element below, nubbin be Ag and inevitable impurity,The nitride forming element is one of Ti, Hf, Zr and Nb,The addition element be selected from one or more of In, Sn, Al, Mn and Zn,Ag content in the powdered ingredients is 25 mass % or more,In copper part engagement slurry painting process, it is dry after Ag and nitride forming element layer with a thickness of 20 μ

    m withIt is upper and 300 μ

    m hereinafter,In the heating step, by spreading Ag to the copper sheet side, on the boundary of the ceramic substrate and the copper sheetFace forms the molten metal region, and forms nitride layer on the surface of the ceramic substrate.

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