Lead frame, the semiconductor packages including lead frame and the method for production lead frame frame

Lead frame, the semiconductor packages including lead frame and the method for production lead frame frame

  • CN 104,078,438 B
  • Filed: 03/27/2014
  • Issued: 03/08/2019
  • Est. Priority Date: 03/28/2013
  • Status: Active Grant
First Claim
Patent Images

1. a kind of lead frame, comprising:

  • Die pad is configured for accommodating bare die;

    AndLead finger is attached to braced frame,The lead finger includes;

    Interior section is configured as being electrically coupled to the contact pad of the bare die;

    AndExterior section, including the attachment part in the end away from the interior section of the lead finger, wherein described attachedSocket part point includes the first width, length and thickness, and its split shed extends through the thickness of the attachment part, whereinThe exterior section of the lead finger is bent to form gull gull wing lead, wherein the opening is configured to removing the institute surroundedIt states braced frame to be spaced apart with the edge away from the interior section of the lead finger later, so that the attachment part is keptNot cut off with the lead finger and being configured to be welded to external pads.

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