Printed circuit board material resin combination and prepreg, resin sheet, clad with metal foil plywood and the printed circuit board for having used it

Printed circuit board material resin combination and prepreg, resin sheet, clad with metal foil plywood and the printed circuit board for having used it

  • CN 104,093,764 B
  • Filed: 01/24/2013
  • Issued: 06/08/2018
  • Est. Priority Date: 01/31/2012
  • Status: Active Grant
First Claim
Patent Images

1. It is as the material of printed circuit board and the clad with metal foil plywood that uses 1. a kind of clad with metal foil plywood, packetMetal foil containing prepreg He the one or two sides for being layered in the prepreg, the prepreg include base material and make an addition to the base materialResin combination, the surface roughness Rz of the rough surface of metal foil is 1.0 μ

  • m~2.5 μ

    m,The resin combination includes epoxide (A), cyanate esters (B) and inorganic filling material (C), the ringOxygen compound (A) is selected from by biphenyl aralkyl type epoxy compound, naphthalene type ring oxygen compound, double naphthalene type ring oxygen compounds, anthraceneQuinoid epoxide, naphthols aralkyl type epoxy compound and XYLOCK type rings oxygen compound composition group in a kind withOn, which is selected from by naphthols aralkyl-type cyanate esters composition, aromatic hydrocarbon formaldehyde type cyanate chemical combinationOne or more of group of object and biphenyl aralkyl-type cyanate esters composition, relative to the epoxide (A) and the cyanogenThe total amount of ester compound (B), the containing ratio of the epoxide (A) is 60~75 mass %.

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