METHOD FOR THE PRODUCTION OF A CIRCUIT BOARD INVOLVING THE REMOVAL OF A SUBREGION THEREOF, AND USE OF SUCH A METHOD

METHOD FOR THE PRODUCTION OF A CIRCUIT BOARD INVOLVING THE REMOVAL OF A SUBREGION THEREOF, AND USE OF SUCH A METHOD

  • CN 104,106,318 A
  • Filed: 12/03/2012
  • Published: 10/15/2014
  • Est. Priority Date: 12/05/2011
  • Status: Active Application
First Claim
Patent Images

1. for the production of circuit board (1, 15, 25) method, it relates to the subregion (6 that removes this circuit board, 6 '"'"', 16, 26), wherein circuit board (1, 15, 25) at least two layers or synusia (2, 3, 4, 5) interconnect, and by providing or use anti-adhered materials (7, 17, 30), prevent the subregion (6 that will remove, 6 '"'"', 16, 26) be connected to circuit board (1, 15, 25) adjacent lamina, and the subregion (6 that will remove, 6 '"'"', 16, 26) fringe region and circuit board (1, 15, 25) neighboring region separately, it is characterized in that, fringe region is separated or cut apart (8, 19) after, the subregion (6 that this will be removed, 6 '"'"', 16, 26) outer surface (9, 20, 27) connect or be attached to outer member (11, 21, 28), by mentioning or this outer member (11 of displacement, 21, 28) subregion (6 that this will be removed, 6 '"'"', 16, 26) from this circuit board (1, 15, 25) adjacent lamina is separated.

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