Semiconductor Component with Integrated Crack Sensor and Method for Detecting a Crack in a Semiconductor Component

Semiconductor Component with Integrated Crack Sensor and Method for Detecting a Crack in a Semiconductor Component

  • CN 104,183,578 A
  • Filed: 05/22/2014
  • Published: 12/03/2014
  • Est. Priority Date: 05/22/2013
  • Status: Active Application
First Claim
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1. a semiconductor device, comprising:

  • Semiconductor body, has bottom side, in the vertical direction and described bottom side away from the top side at interval and the thickness on described vertical direction;

    AndCrack sensors, is configured to detect the crack in described semiconductor body, wherein-described crack sensors extends into described semiconductor body, and-the distance between described crack sensors and described bottom side is less than the described thickness of described semiconductor body.

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