Singulation of light emitting devices before and after phosphor application

Singulation of light emitting devices before and after phosphor application

  • CN 104,205,365 B
  • Filed: 03/08/2013
  • Issued: 06/16/2020
  • Est. Priority Date: 03/19/2012
  • Status: Active Grant
First Claim
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1. A method of making a light emitting device comprising:

  • mounting a wafer including a plurality of light emitting elements on a stretchable film, each light emitting element having an upper surface opposite a lower surface and one or more side surfaces connecting the upper surface to the lower surface, wherein the lower surface is connected to the stretchable film;

    dicing the wafer using laser dicing to singulate the light emitting elements;

    after dicing the wafer, stretching the stretchable film to provide a chip spacing between the light emitting elements;

    after stretching the stretchable film, disposing a filling material in the inter-chip spaces between the light emitting elements;

    after disposing the filler material, coating the light emitting element with a wavelength converting material to provide a wavelength converting material coated light emitting element sheet, the wavelength converting material partially but not completely covering the side surfaces of the light emitting element, the wavelength converting material contacting the entire upper surface of the light emitting element; and

    after the light emitting elements are coated, the wavelength conversion material coated light emitting element sheet is diced by mechanical cutting to singulate the wavelength conversion material coated light emitting elements, and a wavelength conversion coating layer is formed that extends only partially down the side surfaces of the light emitting elements.

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