The selected part of protective coating is removed from substrate

The selected part of protective coating is removed from substrate

  • CN 104,245,157 B
  • Filed: 01/07/2014
  • Issued: 09/18/2018
  • Est. Priority Date: 01/08/2013
  • Status: Active Grant
First Claim
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1. selectivity applies the method on moisture-resistant protective coating to electronic device subassemblies, this method includes:

  • Apply the one or more electronics groups for including the moisture-resistant protective coating of poly- (paraxylene) to electronic device subassembliesOn part;

    WithDistribution includes granular solids two on the moisture-resistant protective coating of at least one selected part of electronic device subassembliesCarbonoxide removes medium and with the moisture-resistant protective coating of removing medium ablation at least one selected part with selectivelyIt removes the moisture-resistant protective coating of at least one selected part and at least one selection is exposed by moisture-resistant protective coatingComponent or feature expose electronic device subgroup dress from there through the moisture-resistant protective coating for removing at least one selected partThe component or feature of at least one selection of part.

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