Stannum, argentum and copper lead-free solder and production method thereof

Stannum, argentum and copper lead-free solder and production method thereof

  • CN 104,289,824 A
  • Filed: 09/30/2014
  • Published: 01/21/2015
  • Est. Priority Date: 09/30/2014
  • Status: Active Grant
First Claim
Patent Images

1. a Sn-Ag-Cu lead-free solder, is characterized in that, the composition of this solder and content percentage, Ag:

  • 1.0 ~ 5.0%, Cu;

    0.1 ~ 1.0%, Y;

    0.1 ~ 0.5%, Ce;

    0.1 ~ 0.5%, surplus is Sn, and its medium trace element is Y and Ce.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×