Sputtering device

Sputtering device

  • CN 104,294,225 A
  • Filed: 07/18/2014
  • Published: 01/21/2015
  • Est. Priority Date: 07/19/2013
  • Status: Active Application
First Claim
Patent Images

1. a sputter equipment, wherein,This sputter equipment comprises:

  • Vacuum chamber;

    Vacuum pump, it is for being exhausted above-mentioned vacuum chamber;

    Film forming roller, it is located in above-mentioned vacuum chamber;

    Target, it is relative with above-mentioned film forming roller;

    Partition wall, it surrounds above-mentioned target;

    Multiple gas supply port, the plurality of gas supply port at the internal surface opening of above-mentioned partition wall, for the direction supply gas to above-mentioned target;

    AndMultiple gas supply pipe, the plurality of gas supply pipe to be located at outside above-mentioned partition wall and to be connected with above-mentioned multiple gas supply port,This sputter equipment forms film on the rectangular film in the surface transport along above-mentioned film forming roller.

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