Heat dissipation module

Heat dissipation module

  • CN 104,378,950 A
  • Filed: 08/13/2013
  • Published: 02/25/2015
  • Est. Priority Date: 08/13/2013
  • Status: Active Application
First Claim
Patent Images

1. dispel the heat a module, comprising:

  • One housing comprises multiple independently housing cavity, these housing cavity are not communicated with each other, each housing cavity is communicated with an open end of at least one heat pipe, and this open end is communicated with and is positioned at a heat pipe chamber of this heat pipe, wherein this independently housing cavity be communicated with this heat pipe chamber.

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