Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging

Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging

  • CN 104,403,277 A
  • Filed: 12/25/2014
  • Published: 03/11/2015
  • Est. Priority Date: 12/25/2014
  • Status: Active Application
First Claim
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1. a preparation method for LED high-performance epoxy resin composition, is characterized in that comprising the steps:

  • (1) raw material preparation;

    composition epoxy resin is made up of component A and B component, wherein component A comprises the epoxy resin composition that 99.3-99.85% is made up of cycloaliphatic epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol A epoxide resin, polyurethane modified epoxy resin, the defoamer of 0.1-0.5% and the complementary color agent of 0.05-0.2%;

    B component comprises curing agent mixture that 90-97.45% is made up of methyl hexahydrophthalic anhydride and HHPA, the properties-correcting agent of 1-5.5%, the oxidation inhibitor of 0.2-0.5%, the uv-absorbing agent of 0.2-0.5%, the photostabilizer of 0.1-0.3%, the promotor of 1-3%, the releasing agent of 0.05-0.2%;

    (2) be mixed in proportion;

    component A and B component are by weight 100/(90-150) mix;

    (3) vacuum defoamation;

    vacuum defoamation 10-30 minute at 50-60 DEG C;

    (4) solidify;

    be cast in after device through machine, be cured under 120 DEG C of-150 DEG C of conditions and prepare.

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