Semiconductor packaging structure and manufacturing method thereof

Semiconductor packaging structure and manufacturing method thereof

  • CN 104,425,396 A
  • Filed: 09/02/2013
  • Published: 03/18/2015
  • Est. Priority Date: 09/02/2013
  • Status: Active Application
First Claim
Patent Images

1. a semiconductor package, is characterized in that, comprising:

  • Several conducting element separated from each other, respectively comprises one first adjacent current-carrying part and one second current-carrying part;

    One chip, is electrically connected to those conducting elements;

    One packaging body, those first current-carrying parts of this chip coated and those conducting elements;

    AndSeveral solder projection, only with those second conductive portions contact of those conducting elements.

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