Lead frame, semiconductor packaging body and manufacturing method thereof

Lead frame, semiconductor packaging body and manufacturing method thereof

  • CN 104,465,596 A
  • Filed: 12/05/2014
  • Published: 03/25/2015
  • Est. Priority Date: 12/05/2014
  • Status: Active Application
First Claim
Patent Images

1. a lead frame, is characterized in that, this lead frame comprises:

  • Supporting disk, it is configured as bearing wafer, the connecting rod that described supporting disk comprises multiple independent blocks and is connected between independent blocks, and the thickness at least partially in described connecting rod is less than the thickness of described independent blocks;

    Be positioned at least one pin array around described supporting disk, it is configured as being connected to the wafer being carried on described supporting disk.

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