Solder alloy, solder paste, and electronic circuit board

Solder alloy, solder paste, and electronic circuit board

  • CN 104,507,633 A
  • Filed: 06/25/2013
  • Published: 04/08/2015
  • Est. Priority Date: 07/19/2012
  • Status: Active Application
First Claim
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1. a soldering alloy, is characterized in that, it is the soldering alloy of tin-silver-copper system,Containing tin, silver, copper, bismuth, nickel and cobalt,Relative to the total amount of described soldering alloy,Described silver containing proportional be below more than 2 quality % 4 quality %,Described nickel containing proportional be below more than 0.01 quality % 0.15 quality %,Described cobalt containing proportional be below more than 0.001 quality % 0.008 quality %.

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