Vapor deposition system and vapor deposition method

Vapor deposition system and vapor deposition method

  • CN 104,561,932 A
  • Filed: 01/28/2015
  • Published: 04/29/2015
  • Est. Priority Date: 01/28/2015
  • Status: Active Application
First Claim
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1. a gas-phase deposition system, is characterized in that, comprising:

  • Accommodating chamber;

    Be arranged on the base station for bearing substrate in described accommodating chamber, accommodating chamber is separated the sealable reaction chamber of formation by described base station;

    Be arranged on the spray equipment be oppositely arranged with base station in described reaction chamber, wherein, described spray equipment is for spraying the process gas of vapour deposition;

    To be arranged in described accommodating chamber and air cooling equipment outside described reaction chamber, it comprise multiple go out the air outlet of cold wind and the air output of each air outlet can control separately;

    The cold wind of the air outlet of described air cooling equipment can blow to described base station.

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