Preparation method for TSV (Through Silicon Via) redistribution layer based on AIN (Aluminium Nitride) modified polymer composite dielectric
Preparation method for TSV (Through Silicon Via) redistribution layer based on AIN (Aluminium Nitride) modified polymer composite dielectric
- CN 104,681,485 A
- Filed: 01/16/2015
- Published: 06/03/2015
- Est. Priority Date: 01/16/2015
- Status: Active Application
- EN CH
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- Pin
