Solid-state imaging device, method for manufacturing the same, and electronic apparatus

Solid-state imaging device, method for manufacturing the same, and electronic apparatus

  • CN 104,716,149 B
  • Filed: 12/03/2014
  • Issued: 10/27/2020
  • Est. Priority Date: 12/13/2013
  • Status: Active Grant
First Claim
Patent Images

1. A solid-state image pickup device, comprising:

  • a solid-state image pickup element that outputs an image signal depending on an amount of light sensed on a light sensing surface;

    a semiconductor element that performs signal processing on the image signal output from the solid-state image pickup element; and

    a substrate electrically connected to the solid-state image pickup element and the semiconductor element,wherein the semiconductor element is sealed by a molding resin in a state of being accommodated in an accommodation region provided on the substrate,wherein the solid-state image pickup element is laminated on the semiconductor element with the molding resin interposed therebetween,wherein inner leads connected to a plurality of bonding wires for electrically connecting the solid-state image pickup element and the semiconductor element to each other are formed on an inner surface of the substrate, andwherein a stepped portion that makes a part of a surface of the inner surface where the inner leads are formed lower is provided in the accommodation region, and wherein the inner leads in the stepped portion are connected to bonding wires for electrical connection with the semiconductor element among the plurality of bonding wires, and the bonding wires for electrical connection with the semiconductor element do not protrude from the inner surface of the substrate.

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