RESIN COMPOSITION AND USES OF THE SAME

RESIN COMPOSITION AND USES OF THE SAME

  • CN 104,744,890 A
  • Filed: 01/10/2014
  • Published: 07/01/2015
  • Est. Priority Date: 12/31/2013
  • Status: Active Application
First Claim
Patent Images

1. a resin combination, is characterized in that comprising:

  • One thermosetting resin component, its dissipation factor (Df)≤

    0.006 when 1 GHz (GHz);

    AndOne filler, it is selected from following group;

    the sinter of strontium titanate, calcium titanate, barium titanate, magnesium titanate, aforesaid arbitrary combination and this arbitrary combination;

    Wherein, this filler be through or at least one of undoped silicon, cobalt, nickel, manganese and rare earth element;

    Median size (the D of this filler 50) be 2 microns of distributions to 10 microns and in single spike;

    And the content of this filler is these thermosetting resin component 10 weight part to 600 weight parts of every 100 weight parts.

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