Silicon through hole deep-hole filling process

Silicon through hole deep-hole filling process

  • CN 104,752,330 A
  • Filed: 12/31/2013
  • Published: 07/01/2015
  • Est. Priority Date: 12/31/2013
  • Status: Active Grant
First Claim
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1. a silicon through hole deep hole fill process, for improving the film coverage that silicon through hole deep hole is filled, it is characterized in that, job step is as follows:

  • Steps A 1, passes into process gas in magnetron sputtering apparatus;

    Steps A 2, carries out thin film deposition with the first radio-frequency power, the first air pressure to described silicon through hole;

    Steps A 3, carries out thin film deposition with the second radio-frequency power, the second air pressure to described silicon through hole;

    Repeat steps A 2 and A3, until described silicon through hole internal membrane coverage rate is even, and reach required thickness.

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