Process for preparing a semiconductor structure for mounting and mounted optoelectronic semiconductor structure

Process for preparing a semiconductor structure for mounting and mounted optoelectronic semiconductor structure

  • CN 104,752,572 A
  • Filed: 09/27/2007
  • Published: 07/01/2015
  • Est. Priority Date: 09/28/2006
  • Status: Active Application
First Claim
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1. one kind for the preparation of the technique of semiconductor structure being installed to carrier, this technique comprises:

  • make backing material substantially fill the hole limited by the surface formed in the semiconductor structure, and wherein said hole extends in the epitaxial structure in described semiconductor structure;

    Backing material is made fully to solidify the semiconductor structure supported when being installed to carrier,Wherein said epitaxial structure comprises the luminous zone be arranged between n-type area and p-type area, described hole extends through described p-type area and described luminous zone enters in described n-type area, and described hole is the through hole formed between each region of semiconductor structure, and described through hole contributes to the electrical connection in each region of semiconductor structure.

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