Chip packaging structure and manufacture method thereof

Chip packaging structure and manufacture method thereof

  • CN 104,779,220 A
  • Filed: 03/27/2015
  • Published: 07/15/2015
  • Est. Priority Date: 03/27/2015
  • Status: Active Application
First Claim
Patent Images

1. a chip-packaging structure, comprising:

  • Lead frame, has carrier and is positioned at the first pin around described carrier;

    Be positioned at the first conductive pole be electrically connected on described first pin and with described first pin;

    First chip, has active face and the back surface relative with described active face, and described back surface is mounted on described carrier, the electrode pad of described active face is provided with the first electric connector;

    First plastic-sealed body, for encapsulating described first chip and being encapsulated described lead frame, and there is first surface and the second surface relative with described first surface, wherein, described first surface exposes described first conductive pole and described first electric connector, described second surface exposes described first pinBe positioned at the second pin on described first surface, for described first electric connector and described first conductive pole being electrically connected.

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