Multilayer wiring board

Multilayer wiring board

  • CN 104,812,160 A
  • Filed: 10/23/2014
  • Published: 07/29/2015
  • Est. Priority Date: 01/24/2014
  • Status: Active Application
First Claim
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1. a multi-layer wire substrate, this multi-layer wire substrate possesses the duplexer being carried out by multiple insulating barrier being laminated, and it is characterized in that, comprising:

  • Grounding electrode, this grounding electrode is formed in the central portion of an interarea of described duplexer;

    Multiple absolute electrode, the plurality of absolute electrode arrangement is formed in the periphery of an interarea of described duplexer;

    AndSurface insulating film, this surface insulating film has insulation division and surface coverage portion between electrode, wherein, between this electrode, insulation division is arranged to the end edge portion covering described grounding electrode, and insulate between described grounding electrode and described each absolute electrode, this surface coverage portion is formed in the surface of described grounding electrode, and this grounding electrode is divided into multiple region.

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