Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste

Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste

  • CN 104,816,104 A
  • Filed: 02/04/2015
  • Published: 08/05/2015
  • Est. Priority Date: 02/04/2014
  • Status: Active Application
First Claim
Patent Images

1. an Ag ball, is characterized in that, the content of U is below 5ppb,The content of Th is below 5ppb,Purity is more than 99.9% and less than 99.9995%,Alpha ray amount is 0.0200cph/cm 2below, Pb or Bi any one content or the total content of Pb and Bi be more than 1ppm, sphericity is more than 0.90.

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